Machining machine that can cut and grind at the same time

Japan Takata Industrial Co., Ltd. will launch the cutting machine "Blast Cut Device" in June 2007. Ultrasonic vibration is applied to a high speed rotating diamond blade, and grinding is performed while cutting.

Not only can you cut materials that were previously difficult to machine, but you can also grind a smooth section in a short time.

The blade does not need to be trimmed. Moreover, the diamond particles are uniformly embedded by electroforming, and the life of the tool is extended. In addition to hard materials such as glass and cemented carbide, soft materials such as aluminum alloys and resins can be cut. In addition, it can be used for processing composite materials such as metals, inorganic materials, and resins, and components such as driver ICs for displays.

The device has an external dimensions of 900 x 760 x 1600 mm and a weight of 520 kg. It can process workpieces up to 100mm in diameter. The maximum output of the ultrasonic spindle is 400W. The price is 13.5 million yen.