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At the provincial science and technology awards conference held yesterday, the project “Development and Industrialization of Multi-line Cutting Equipment for Electronic Device Substrate Processing†won the first prize of Provincial Science and Technology Progress Award. It is reported that the domestic market share of project products has reached more than 70% and exported to Germany, Japan and other countries.
Magnetic materials, sapphire, crystal and large-scale integrated circuits are strategic emerging industries in China, and they are inseparable from various types of substrates. According to statistics, more than 85% of the total global production of substrate materials is made in China, with an annual output value of nearly 100 billion yuan. Because China has been using traditional internal circular cutting machine and EDM cutting machine for rough processing of raw materials, processing precision and efficiency are low, material loss is high, and it is at the low end of the industrial chain for a long time.
In order to reverse the passive situation, after nearly 10 years of research, Professor Dai Yuxing led the industry-university-research and innovation team to solve the problems of product accuracy, efficiency, reliability, cost-effectiveness, etc., and realized the multi-wire cutting control method, core components, processing technology and complete equipment. A comprehensive breakthrough in technology has broken the monopoly of foreign technology. Successfully developed more than 10 kinds of special multi-line cutting machine tools in 3 categories, among which the curved surface multi-line cutting machine has filled the gap at home and abroad. The expert group believes that the overall technology is the first in China and has reached the international advanced level. Among them, the swing cutting and routing technology and the cutting line tension control technology are at the international leading level.
Abstract The thin steel wire is used as a knife blade. The hard and hard abrasive is the blade. In the high-speed sawing movement of 1200 meters per minute, a 400 mm long silicon germanium is cut into 1400 pieces of 0.18 mm thick silicon wafer at a time. With Hunan Yujing Machinery Co., Ltd. join hands with Hunan University...
The thin steel wire is the knife handle, and the hard and hard abrasive is the blade. In the high-speed sawing movement of 1200 meters per minute, a 400 mm long silicon germanium is cut into 1400 pieces of 0.18 mm thick silicon wafer at a time. With the advent of Hunan Yujing Machinery Co., Ltd. and the electronic equipment substrate processing multi-line cutting machine developed by Hunan University and other universities, China's crystal, magnetic materials and other related industries have realized industrial upgrading from selling raw materials to exporting substrates.